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Pyyan / Compare / Ascend 950DT vs B200 vs MI400

Ascend 950DT vs B200 vs MI400

3 of 5

GPU & AI Chips · verified 10 Sept 2026

×HAscend 950DTHuaweicurrent
×B200NVIDIAcurrent
×MI400AMDcurrent
2 slots left
SpecificationAscend 950DTB200MI400
Summary144GB on Huawei's own HBM, and the part China is building gigawatts around.The current volume Blackwell part.Double NVIDIA's memory capacity.
Memory144GB HiZQ 2.0192GB HBM3e432GB HBM4
Bandwidth4 TB/s—19.6 TB/s
PriceAbove ¥250,000 (about $37K), reported$30–50K—
VendorHuaweiNVIDIAAMD
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialHuawei ↗NVIDIA ↗AMD ↗

Highlighted rows are where these differ.

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage

Best for serving models where Nvidia cannot be bought.

Full spec sheet →

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

MI400

  • 19.6 TB/s bandwidth
  • 40 PFLOPS FP4
  • $7.2B in commitments

Best for large-model inference.

Full spec sheet →