PyyanThe AI Index

Pyyan / Compare / Ascend 950DT vs B300 Blackwell Ultra vs B200

Ascend 950DT vs B300 Blackwell Ultra vs B200

3 of 5

GPU & AI Chips · verified 10 Sept 2026

×HAscend 950DTHuaweicurrent
×B300 Blackwell UltraNVIDIAcurrent
×B200NVIDIAcurrent
2 slots left
SpecificationAscend 950DTB300 Blackwell UltraB200
Summary144GB on Huawei's own HBM, and the part China is building gigawatts around.15 PFLOPS dense FP4.The current volume Blackwell part.
Memory144GB HiZQ 2.0288GB HBM3e192GB HBM3e
Bandwidth4 TB/s8 TB/s—
PriceAbove ¥250,000 (about $37K), reported~$40–50K (verify)$30–50K
VendorHuaweiNVIDIANVIDIA
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialHuawei ↗NVIDIA ↗NVIDIA ↗

Highlighted rows are where these differ.

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage

Best for serving models where Nvidia cannot be bought.

Full spec sheet →

B300 Blackwell Ultra

  • 8 TB/s memory bandwidth
  • Per-GPU pricing widely misquoted — one source cites rack pricing

Best for frontier training.

Full spec sheet →

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →