Pyyan / Compare / Ascend 950DT vs B300 Blackwell Ultra vs B200 vs H100

Ascend 950DT vs B300 Blackwell Ultra vs B200 vs H100

4 of 5

GPU & AI Chips · verified 10 Sept 2026

×HAscend 950DTHuaweicurrent
×B300 Blackwell UltraNVIDIAcurrent
×B200NVIDIAcurrent
×H100NVIDIAcurrent
1 slot left
SpecificationAscend 950DTB300 Blackwell UltraB200H100
Summary144GB on Huawei's own HBM, and the part China is building gigawatts around.15 PFLOPS dense FP4.The current volume Blackwell part.The workhorse of the previous generation.
Memory144GB HiZQ 2.0288GB HBM3e192GB HBM3e80GB HBM3
Bandwidth4 TB/s8 TB/s
PriceAbove ¥250,000 (about $37K), reported~$40–50K (verify)$30–50K$25–40K
VendorHuaweiNVIDIANVIDIANVIDIA
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialHuaweiNVIDIANVIDIANVIDIA

Highlighted rows are where these differ.

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage

Best for serving models where Nvidia cannot be bought.

Full spec sheet →

B300 Blackwell Ultra

  • 8 TB/s memory bandwidth
  • Per-GPU pricing widely misquoted — one source cites rack pricing

Best for frontier training.

Full spec sheet →

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

H100

The workhorse of the previous generation.

Best for value.

Full spec sheet →