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Pyyan / Compare / B200 vs MI400 vs Ascend 950DT

B200 vs MI400 vs Ascend 950DT

3 of 5

GPU & AI Chips · verified 24 Sept 2026

×B200NVIDIAcurrent
×MI400AMDcurrent
×HAscend 950DTHuaweicurrent
2 slots left
SpecificationB200MI400Ascend 950DT
SummaryThe current volume Blackwell part.Double NVIDIA's memory capacity.144GB on Huawei's own HBM, and the part China is building gigawatts around.
Memory192GB HBM3e432GB HBM4144GB HiZQ 2.0
Bandwidth—19.6 TB/s4 TB/s
Price$30–50K—Above ¥250,000 (about $37K), reported
VendorNVIDIAAMDHuawei
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialNVIDIA ↗AMD ↗Huawei ↗

Highlighted rows are where these differ.

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

MI400

  • 19.6 TB/s bandwidth
  • 40 PFLOPS FP4
  • $7.2B in commitments

Best for large-model inference.

Full spec sheet →

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage
  • Successor Ascend 960DT pulled forward to Q1 2027, Huawei said on 17 September

Best for serving models where Nvidia cannot be bought.

Full spec sheet →