B200 vs MI400 vs Ascend 950DT vs H100

Pyyan / Compare / B200 vs MI400 vs Ascend 950DT vs H100

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GPU & AI Chips · verified 24 Sept 2026

×B200NVIDIAcurrent

×MI400AMDcurrent

×HAscend 950DTHuaweicurrent

×H100NVIDIAcurrent

Specification	B200	MI400	Ascend 950DT	H100
Summary	The current volume Blackwell part.	Double NVIDIA's memory capacity.	144GB on Huawei's own HBM, and the part China is building gigawatts around.	The workhorse of the previous generation.
Memory	192GB HBM3e	432GB HBM4	144GB HiZQ 2.0	80GB HBM3
Bandwidth	—	19.6 TB/s	4 TB/s	—
Price	$30–50K	—	Above ¥250,000 (about $37K), reported	$25–40K
Vendor	NVIDIA	AMD	Huawei	NVIDIA
Category	GPU & AI Chips	GPU & AI Chips	GPU & AI Chips	GPU & AI Chips
Official	NVIDIA ↗	AMD ↗	Huawei ↗	NVIDIA ↗

Highlighted rows are where these differ.

Best for general training.

Best for large-model inference.

4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage
Successor Ascend 960DT pulled forward to Q1 2027, Huawei said on 17 September

Best for serving models where Nvidia cannot be bought.

The workhorse of the previous generation.

Best for value.