Pyyan / Compare / B200 vs Ascend 950DT

B200 vs Ascend 950DT

2 of 5

GPU & AI Chips · verified 24 Sept 2026

B200NVIDIAcurrent
HAscend 950DTHuaweicurrent
3 slots left
SpecificationB200Ascend 950DT
SummaryThe current volume Blackwell part.144GB on Huawei's own HBM, and the part China is building gigawatts around.
Memory192GB HBM3e144GB HiZQ 2.0
Bandwidth—4 TB/s
Price$30–50KAbove ¥250,000 (about $37K), reported
VendorNVIDIAHuawei
CategoryGPU & AI ChipsGPU & AI Chips
OfficialNVIDIA ↗Huawei ↗

Highlighted rows are where these differ.

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage
  • Successor Ascend 960DT pulled forward to Q1 2027, Huawei said on 17 September

Best for serving models where Nvidia cannot be bought.

Full spec sheet →