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Pyyan / Compare / B300 Blackwell Ultra vs B200 vs Ascend 950DT

B300 Blackwell Ultra vs B200 vs Ascend 950DT

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GPU & AI Chips · verified 24 Sept 2026

×B300 Blackwell UltraNVIDIAcurrent
×B200NVIDIAcurrent
×HAscend 950DTHuaweicurrent
2 slots left
SpecificationB300 Blackwell UltraB200Ascend 950DT
Summary15 PFLOPS dense FP4.The current volume Blackwell part.144GB on Huawei's own HBM, and the part China is building gigawatts around.
Memory288GB HBM3e192GB HBM3e144GB HiZQ 2.0
Bandwidth8 TB/s—4 TB/s
Price~$40–50K (verify)$30–50KAbove ¥250,000 (about $37K), reported
VendorNVIDIANVIDIAHuawei
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialNVIDIA ↗NVIDIA ↗Huawei ↗

Highlighted rows are where these differ.

B300 Blackwell Ultra

  • 8 TB/s memory bandwidth
  • Per-GPU pricing widely misquoted — one source cites rack pricing

Best for frontier training.

Full spec sheet →

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage
  • Successor Ascend 960DT pulled forward to Q1 2027, Huawei said on 17 September

Best for serving models where Nvidia cannot be bought.

Full spec sheet →