Pyyan / Compare / H100 vs B200 vs Ascend 950DT

H100 vs B200 vs Ascend 950DT

3 of 5

GPU & AI Chips · verified 24 Sept 2026

×H100NVIDIAcurrent
×B200NVIDIAcurrent
×HAscend 950DTHuaweicurrent
2 slots left
SpecificationH100B200Ascend 950DT
SummaryThe workhorse of the previous generation.The current volume Blackwell part.144GB on Huawei's own HBM, and the part China is building gigawatts around.
Memory80GB HBM3192GB HBM3e144GB HiZQ 2.0
Bandwidth——4 TB/s
Price$25–40K$30–50KAbove ¥250,000 (about $37K), reported
VendorNVIDIANVIDIAHuawei
CategoryGPU & AI ChipsGPU & AI ChipsGPU & AI Chips
OfficialNVIDIA ↗NVIDIA ↗Huawei ↗

Highlighted rows are where these differ.

H100

The workhorse of the previous generation.

Best for value.

Full spec sheet →

B200

  • Sold out through mid-2026
  • ~3.6M unit backlog

Best for general training.

Full spec sheet →

Ascend 950DT

  • 4 TB/s memory bandwidth and a 2 TB/s interconnect, 2.5x the Ascend 910C
  • HiZQ 2.0 is Huawei's own memory standard rather than a licensed HBM3 or HBM3e part
  • Indicated price rose 20% to 50% in two months to September 2026, on a memory shortage
  • Successor Ascend 960DT pulled forward to Q1 2027, Huawei said on 17 September

Best for serving models where Nvidia cannot be bought.

Full spec sheet →